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ORCIDISQED 2004: San Jose, California, USA
- 5th International Symposium on Quality of Electronic Design (ISQED 2004), 22-24 March 2004, San Jose, CA, USA. IEEE Computer Society 2004, ISBN 0-7695-2093-6
ISQED Tutorials: Compact Modeling and Analysis for Nanometer-Scale CMOS Design
- Kerry Bernstein:
Nanometer-Scale CMOS Devices. 7 - Jeff Davis:
Interconnect Modeling. 7 - Andrew B. Kahng:
Manufacturability . 8 - Kaushik Roy:
Low-Power Design. 8 - Nagib Hakim:
Coping with Uncertainty. 9
ISQED Panel Discussion EP1
- Tets Maniwa, Pallab K. Chatterjee:
Evening Panel Discussion: DFM PDK's: Where Do They Belong To? Are Process Design Kits (PDKs) the Answer for Modern Design for Manufacturing (DFM) Issues? 11-13
Plenary Session I
- John Chilton:
Simplify: Enable Quality, Enable Innovation. 17 - Marc E. Levitt:
Design for Manufacturing? Design for Yield!!! 19 - Larry Bock:
Why Nano Technology? Why Now? And What Might Its Impact on Electronics. 21
Physical Design Migration
- Fang Fang, Jianwen Zhu:
Calligrapher: A New Layout Migration Engine Based on Geometric Closeness. 25-30 - Kuang-Kuo Lin, Sudhakar Kale, Aditi Nigam:
Methodology for Automated Layout Migration for 90 nm Itanium®2 Processor Design. 31-35 - Masanori Hashimoto
, Kazunori Fujimori, Hidetoshi Onodera:
Automatic Generation of Standard Cell Library in VDSM Technologies. 36-41
Device and Memory
- Jin He, Xuemei Xi, Mansun Chan, Chung-Hsun Lin, Ali M. Niknejad, Chenming Hu:
A Non-Charge-Sheet Based Analytical Model of Undoped Symmetric Double-Gate MOSFETs Using SPP Approach. 45-50 - Y. Z. Xu, O. Pohland, C. Cai, Helmut Puchner:
Leakage Increase of Narrow and Short BCPMOS. 51-54 - Huifang Qin, Yu Cao, Dejan Markovic, Andrei Vladimirescu, Jan M. Rabaey:
SRAM Leakage Suppression by Minimizing Standby Supply Voltage. 55-60
Poster Session
- Zhu Pan, Yici Cai, Sheldon X.-D. Tan, Zuying Luo, Xianlong Hong:
Transient Analysis of On-Chip Power Distribution Networks Using Equivalent Circuit Modeling. 63-68 - Lucanus J. Simonson, King Ho Tam, Nataraj Akkiraju, Mosur Mohan, Lei He:
Leveraging Delay Slack in Flip-Flop and Buffer Insertion for Power Reduction. 69-74 - Herng-Jer Lee, Chia-Chi Chu, Wu-Shiung Feng:
Moment Computations of Nonuniform Distributed Coupled RLC Trees with Applications to Estimating Crosstalk Noise. 75-80 - Daniela De Venuto:
New Test Access for High Resolution SD ADC's by Using the Noise Transfer Function Evaluation. 81-85 - Stuart McCracken, Zeljko Zilic:
Design for Testability of FPGA Blocks. 86-91 - Nikos Konofaos, G. Ph. Alexiou:
New Challenges Emerging on the Design of VLSI Circuits Made of MOSFETs Using New Gate Dielectric Materials. 92-97 - Dongku Kang, Mark C. Johnson, Kaushik Roy:
Simultaneous Multiple-Vdd Scheduling and Allocation for Partitioned Floorplan. 98-103 - Volkan Kursun, Eby G. Friedman:
Node Voltage Dependent Subthreshold Leakage Current Characteristics of Dynamic Circuits. 104-109 - Youngsik Kim, Shekhar Kopuri, Nazanin Mansouri:
Automated Formal Verification of Scheduling Process Using Finite State Machines with Datapath (FSMD). 110-115 - Eren Kursun, Soheil Ghiasi, Majid Sarrafzadeh:
Transistor Level Budgeting for Power Optimization. 116-121 - Sunil Yu, Dusan Petranovic, Shoba Krishnan, Kwyro Lee, Cary Y. Yang:
Resistance Matrix in Crosstalk Modeling for Muliconductor Systems. 122-125 - Bo-Sung Kim, Young-Gi Kim, Soon-Yang Hong:
Low Power 260 k Color TFT LCD One-Chip Driver IC. 126-130 - Woo Hyung Lee, Sanjay Pant, David T. Blaauw:
Analysis and Reduction of On-Chip Inductance Effects in Power Supply Grids. 131-136 - Jong-Eun Koo, Kyung-Ho Lee, Young-Hoe Cheon, Joon-Ho Choi, Moon-Hyun Yoo, Jeong-Taek Kong:
A Variable Reduction Technique for the Analysis of Ultra Large-Scale Power Distribution Networks. 137-142 - M. Moiz Khan, Spyros Tragoudas:
Rewiring for Watermarking Digital Circuits. 143-148
ISQED Luncheon Speech
- Michael Keating:
The IP Quality Revolution. 151-155
Topics in Printability
- Michel Côté, Philippe Hurat:
Layout Printability Optimization Using a Silicon Simulation Methodology. 159-164 - Frank Gennari, Andrew R. Neureuther:
A Pattern Matching System for Linking TCAD and EDA. 165-170 - John Ferguson:
Shifting Methods: Adopting a Design for Manufacture Flow. 171-175
Package Design and Interaction
- Lalitha Immaneni, Anju Kapur, Brett Neal:
Design Tools for Packaging. 179-183 - Meigen Shen, Li-Rong Zheng, Hannu Tenhunen:
Robustness Enhancement through Chip-Package Co-Design for High-Speed Electronics. 184-189 - Roderick P. Cruz:
Flip Chip Advanced Package Solder Joint Embrittlement Fault Isolation Using TDR. 190-195 - Janet Meiling Wang, Kishore Kumar Muchherla, Jai Ganesh Kumar:
A Clustering Based Area I/O Planning for Flip-Chip Technology. 196-201
Test Generation and Application
- Maciej Bellos, Dimitris Bakalis, Dimitris Nikolos, Xrysovalantis Kavousianos:
Low Power Testing by Test Vector Ordering with Vector Repetition. 205-210 - Yonsang Cho, Irith Pomeranz, Sudhakar M. Reddy:
Test Application Time Reduction for Scan Circuits Using Limited Scan Operations. 211-216 - Javier Sosa, Juan A. Montiel-Nelson, Héctor Navarro, José C. García:
Functional Vector Generation for Combinational Circuits Based on Data Path Coverage Metric and Mixed Integer Linear Programming. 217-222
Modeling and Simulations of Electromigration and Eletromagnetic Effect
- Valeriy Sukharev:
Physically-Based Simulation of Electromigration Induced Failures in Copper Dual-Damascene Interconnect. 225-231 - Chanhee Oh, Haldun Haznedar, Martin Gall, Amir Grinshpon, Vladimir Zolotov, Pon Sung Ku, Rajendran Panda:
A Methodology for Chip-Level Electromigration Risk Assessment and Product Qualification. 232-237 - Syed M. Alam, Chee Lip Gan, Carl V. Thompson, Donald E. Troxel:
Circuit Level Reliability Analysis of Cu Interconnects. 238-243 - Pavel V. Nikitin, Vikram Jandhyala, Daniel A. White, Nathan Champagne, John D. Rockway, C.-J. Richard Shi, Chuanyi Yang, Yong Wang, Gong Ouyang, Rob Sharpe, John W. Rockway:
Modeling and Simulation of Circuit-Electromagnetic Effects in Electronic Design Flow. 244-249
Interconnect: Capacitance Extraction and Delay Calculation
- Fangqing Yu, Weiping Shi:
A Divide-and-Conquer Algorithm for 3D Capacitance Extraction. 253-258 - Anirban Basu, Sheng-Chih Lin, Christoph Wasshuber, Adrian M. Ionescu, Kaustav Banerjee:
A Comprehensive Analytical Capacitance Model of a Two Dimensional Nanodot Array. 259-264 - Yves Quéré, Thierry LeGouguec, Pierre-Marie Martin, Fabrice Huret:
Interconnect Mode Conversion in High-Speed VLSI Circuits. 265-270 - Ye Liu, Mei Xue, Zheng-Fan Li, Rui-Feng Xue:
Efficient Capacitance Extraction for Periodic Structures by Shanks Transformation. 271-275 - Xiang Lu, Zhuo Li, Wangqi Qiu, D. M. H. Walker, Weiping Shi:
PARADE: PARAmetric Delay Evaluation under Process Variation. 276-280
Substrate Noise: Analysis and Prevention
- Ranjit Gharpurey, Edoardo Charbon:
Substrate Coupling: Modeling, Simulation and Design Perspectives. 283-290 - Shahab Ardalan, Manoj Sachdev:
An Overview of Substrate Noise Reduction Techniques. 291-296 - Meng-Fan Chang, Kuei-Ann Wen, Ding-Ming Kwai:
Supply and Substrate Noise Tolerance Using Dynamic Tracking Clusters in Configurable Memory Designs. 297-302 - Georgios Veronis, Yi-Chang Lu, Robert W. Dutton:
Modeling of Wave Behavior of Substrate Noise Coupling for Mixed-Signal IC Design. 303-308 - Henry H. Y. Chan, Zeljko Zilic:
Estimating Phase-Locked Loop Jitter due to Substrate Coupling: A Cyclostationary Approach. 309-314
ISQED Panel Discussion EP2
- Ron Wilson, Phil Dworsky:
Evening Panel Discussion: IP Industry: Nordstrom or K-Mart? The Trend Toward Tighter Relationships between Suppliers and Users. 317-319
Plenary Session II
- Hiroto Yasuura:
Digitally Named World: Challenges for New Social Infrastructures. 323 - Pierre G. Paulin:
Designing High Quality, Scaleable SoC??s with Heterogeneous Components. 325 - Krishna Saraswat:
Performance Limitations of Devices and Interconnects and Possible Alternatives for Nanoelectronics. 327
Interconnect Delay and Coupling
- Medha Kulkarni, Tom Chen:
A Sensitivity Based Approach to Analyzing Signal Delay Uncertainty of Coupled Interconnects. 331-336 - Seongkyun Shin, Yungseon Eo, William R. Eisenstadt, Jongin Shim:
Analytical Dynamic Time Delay Model of Strongly Coupled RLC Interconnect Lines Dependent on Switching. 337-342 - Cristian Grecu, Partha Pratim Pande, André Ivanov, Res Saleh:
A Scalable Communication-Centric SoC Interconnect Architecture. 343-348
Analysis of Variations
- Manidip Sengupta, Sharad Saxena, Lidia Daldoss, Glen Kramer, Sean Minehane, Jianjun Cheng:
Application Specific Worst Case Corners Using Response Surfaces and Statistical Models. 351-356 - Ting-Yuan Wang, Charlie Chung-Ping Chen:
SPICE-Compatible Thermal Simulation with Lumped Circuit Modeling for Thermal Reliability Analysis Based on Modeling Order Reduction. 357-362 - Janet Meiling Wang, Omar Hafiz:
Predicting Interconnect Uncertainty with a New Robust Model Order Reduction Method. 363-368
Layout and Design Techniques for Quality and Reliability
- Sandeep Koranne:
A High Performance SIMD Framework for Design Rule Checking on Sony??s PlayStation 2 Emotion Engine Platform. 371-376 - Tetsuya Iizuka, Makoto Ikeda, Kunihiro Asada:
Exact Wiring Fault Minimization via Comprehensive Layout Synthesis for CMOS Logic Cells. 377-380 - Rishi Chaturvedi, Jiang Hu:
Buffered Clock Tree for High Quality IC Design. 381-386
Analog Testing
- Swarup Bhunia, Arijit Raychowdhury, Kaushik Roy:
Frequency Specification Testing of Analog Filters Using Wavelet Transform of Dynamic Supply Current. 389-394 - Yongquan Fan, Zeljko Zilic, Man Wah Chiang:
A Versatile High Speed Bit Error Rate Testing Scheme. 395-400 - Achintya Halder, Abhijit Chatterjee:
Automated Test Generation and Test Point Selection for Specification Test of Analog Circuits. 401-406
Low Power Design
- Man Lung Mui, Kaustav Banerjee, Amit Mehrotra:
Power Supply Optimization in sub-130 nm Leakage Dominant Technologies . 409-414 - Bhaskar Chatterjee, Manoj Sachdev, Ram Krishnamurthy:
Leakage Control Techniques for Designing Robust, Low Power Wide-OR Domino Logic for sub-130 nm CMOS Technologies. 415-420 - Ge Yang, Zhongda Wang, Sung-Mo Kang:
Low Power and High Performance Circuit Techniques for High Fan-In Dynamic Gates. 421-424 - Khushwinder Jasrotia, Jianwen Zhu:
Stacked FSMD: A Power Efficient Micro-Architecture for High Level Synthesis. 425-430
ESD
- Ming-Dou Ker, Wei-Jen Chang, Wen-Yu Lo:
Low-Voltage-Triggered PNP Devices for ESD Protection Design in Mixed-Voltage I/O Interface with Over-VDD and Under-VSS Signal Levels. 433-438 - Sachio Hayashi, Fumihiro Minami, Masaaki Yamada:
Full-Chip Analysis Method of ESD Protection Network. 439-444 - Ming-Dou Ker, Wen-Yi Chen:
Design to Avoid the Over-Gate-Driven Effect on ESD Protection Circuits in Deep-Submicron CMOS Processes. 445-450
DFM Design Techniques
- Justin Gregg, Tom W. Chen:
Post Silicon Power/Performance Optimization in the Presence of ProcessVariations Using Individual Well Adaptive Body Biasing (IWABB). 453-458 - Sobeeh Almukhaizim, Petros Drineas, Yiorgos Makris:
Concurrent Error Detection for Combinational and Sequential Logic via Output Compaction. 459-464 - Karthik Sundararaman, Shambhu J. Upadhyaya, Martin Margala:
Cost Model Analysis of DFT Based Fault Tolerant SOC Designs. 465-469 - Lane Albanese:
Managing Derivative SoC Design Projects to Better Results. 470-477 - Hans-Jürgen Brand, Steffen Rülke, Martin Radetzki:
IPQ: IP Qualification for Efficient System Design. 478-482
Delay Test Issues
- Zhiyuan Wang, Malgorzata Marek-Sadowska, Kun-Han Tsai, Janusz Rajski:
Delay Fault Diagnosis Using Timing Information. 485-490 - Saravanan Padmanaban, Spyros Tragoudas:
An Adaptive Path Delay Fault Diagnosis Methodology. 491-496 - Hangkyu Lee, Irith Pomeranz, Sudhakar M. Reddy:
Scan BIST Targeting Transition Faults Using a Markov Source. 497-502 - Vijay Degalahal, Rajaraman Ramanarayanan, Narayanan Vijaykrishnan, Yuan Xie, Mary Jane Irwin:
The Effect of Threshold Voltages on the Soft Error Rate. 503-508
Circuit Design Trends in DSM
- Hari Ananthan, Aditya Bansal, Kaushik Roy:
FinFET SRAM - Device and Circuit Design Considerations. 511-516 - Volkan Kursun, Siva G. Narendra, Vivek De, Eby G. Friedman:
High Input Voltage Step-Down DC-DC Converters for Integration in a Low Voltage CMOS Process. 517-521 - Ji Luo, Joseph B. Bernstein, J. Ari Tuchman, Hu Huang, Kuan-Jung Chung, Anthony L. Wilson:
A High Performance Radiation-Hard Field Programmable Analog Array . 522-527 - Ahmad Yazdi, Payam Heydari:
The Design and Analysis of Non-Uniform Down-Sized Differential Distributed Amplifiers. 528-533 - Navid Azizi, Farid N. Najm:
An Asymmetric SRAM Cell to Lower Gate Leakage. 534-539
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