Microelectronics Reliability, Volume 47

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Volume 47, Number 1, January 2007

Introductory Invited Papers Research Papers Reseach Note Book reviews

Volume 47, Numbers 2-3, February-March 2007

EuroSimE Special Section Polytronic 2005 Special Section Introductory Invited Paper Review Paper Research Papers

Volume 47, Numbers 4-5, April - May 2007

Editorial Introductory invited papers

Volume 47, Number 6, June 2007

Special Section: Modelling the Negative Bias Temperature Instability Regular Papers Book Review

Volume 47, Number 7, July 2007

Special Section: EOS/ESD Symposium 2005 Regular Papers Book Review

Volume 47, Number 8, August 2007

Special Section: 2006 ROCS Workshop Regular Papers

Volume 47, Numbers 9-11, September - November 2007

Tutorials Topic A. Quality and Reliability Techniques fr Devices and Systems Topic B1. Failure Mechanisms in Silicon Devices: NBTI characterisation - Failure mechanisms related to high K and gate stacks Topic B2. Failure Mechanisms in New Materials and Devices (Low K materials, Interconnects, ESD, ...) Topic C. Electron and Optical Beam Testing (EOBT) Topic D. Advanced Failure Analysis: Sample Preparation, Case Studies Topic E. Failure Mechanisms in Microwave, High Bandgap and Photonic Devices Topic F. Packaging, Assemblies and Passive Components Reliability Topic G. Reliability of Power Devices Topic H. MEMS/MOEMS, Sensors and Actuators Reliability Topic I. Radiation Impact on IC Reliability

Volume 47, Number 12, December 2007

Electronic System Prognostics and Health Management Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimeE 2006) Regular Papers
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