Microelectronics Reliability, Volume 53

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Volume 53, Number 1, January 2013

Special Section: Reliability of micro-interconnects in 3D IC packages Regular Paper Research Papers

Volume 53, Number 2, February 2013

Special Section: Advances in ESD protection for ICs Regular Research Papers

Volume 53, Number 3, March 2013

Research Papers Research Notes

Volume 53, Number 4, April 2013

Research Papers

Volume 53, Number 5, May 2013

Research Papers

Volume 53, Number 6, June 2013

Special Section: Advances in Battery Reliability Regular Research Papers

Volume 53, Number 7, July 2013

Research Papers

Volume 53, Number 8, August 2013

Special Section: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2012 International Conference) Regular Research Papers Research Note

Volume 53, Numbers 9-11, September - November 2013

Tutorial Topic A: Quality and Reliability Techniques for Devices and Systems Topic B: Characterisation and Modelling of Failure Mechanism in Si technologies & Nanoelectronics Topic C: Advanced Techniques for Failure Analysis and case studies Topic D1: Failures in Microwave, Wide Band-Gap Devices Topic D2: Failures in Photonic Devices Topic E1: Packaging, Assemblies Topic E2: Passive Components and MEMS Topic F: Power devices Topic G: Reliability of Photovoltaic and Organic devices: Thin Film, concentration, OLED, TFT

Volume 53, Number 12, December 2013

Research Papers Book Reviews
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