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Sergej Deutsch
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2020 – today
- 2021
- [c18]Michael LeMay, Joydeep Rakshit, Sergej Deutsch, David M. Durham, Santosh Ghosh, Anant Nori, Jayesh Gaur, Andrew Weiler, Salmin Sultana, Karanvir Grewal, Sreenivas Subramoney:
Cryptographic Capability Computing. MICRO 2021: 253-267 - 2020
- [j4]Michael E. Kounavis, David Durham, Sergej Deutsch, Ken Grewal:
Security definitions, entropy measures and constructions for implicitly detecting data corruption. Comput. Commun. 160: 815-846 (2020) - [c17]Michael E. Kounavis, Sergej Deutsch, Santosh Ghosh, David Durham:
K-Cipher: A Low Latency, Bit Length Parameterizable Cipher. ISCC 2020: 1-7 - [i4]Michael E. Kounavis, Sergej Deutsch, Santosh Ghosh, David Durham:
Κ-Cipher: A Low Latency, Bit Length Parameterizable Cipher. IACR Cryptol. ePrint Arch. 2020: 30 (2020) - [i3]Santosh Ghosh, Michael E. Kounavis, Sergej Deutsch:
Gimli Encryption in 715.9 psec. IACR Cryptol. ePrint Arch. 2020: 336 (2020) - [i2]Michael E. Kounavis, David Durham, Sergej Deutsch, Krystian Matusiewicz, David Wheeler:
The MAGIC Mode for Simultaneously Supporting Encryption, Message Authentication and Error Correction. IACR Cryptol. ePrint Arch. 2020: 1460 (2020)
2010 – 2019
- 2019
- [c16]Michael E. Kounavis, David Durham, Sergej Deutsch, Ken Grewal:
IVP: A Three Level Confusion-Diffusion Network Supporting Implicit Data Integrity. ISCC 2019: 1-7 - 2018
- [c15]Michael E. Kounavis, David Durham, Sergej Deutsch, Saeedeh Komijani, Antonios Papadimitriou, Ken Grewal:
There is No Need to Waste Communication Bandwidth on MACs. GIIS 2018: 1-7 - [c14]Michael E. Kounavis, David Durham, Sergej Deutsch, Saeedeh Komijani:
Implicit Data Integrity: Protecting User Data without MACs. ICETE (2) 2018: 709-718 - [i1]Michael E. Kounavis, David Durham, Sergej Deutsch, Antonios Papadimitriou, Amitabh Das:
Cryptographic Constructions Supporting Implicit Data Integrity. IACR Cryptol. ePrint Arch. 2018: 534 (2018) - 2017
- [c13]Michael E. Kounavis, Sergej Deutsch, David Durham, Saeedeh Komijani:
Non-recursive computation of the probability of more than two people having the same birthday. ISCC 2017: 1263-1270 - 2016
- [c12]Ran Wang, Sergej Deutsch, Mukesh Agrawal, Krishnendu Chakrabarty:
The hype, myths, and realities of testing 3D integrated circuits. ICCAD 2016: 58 - 2015
- [j3]Sergej Deutsch, Krishnendu Chakrabarty, Erik Jan Marinissen:
Robust Optimization of Test-Access Architectures Under Realistic Scenarios. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 34(11): 1873-1884 (2015) - [c11]Sergej Deutsch, Krishnendu Chakrabarty:
Software-based test and diagnosis of SoCs using embedded and wide-I/O DRAM. ASP-DAC 2015: 532-537 - [c10]Sergej Deutsch, Krishnendu Chakrabarty:
Contactless pre-bond TSV fault diagnosis using duty-cycle detectors and ring oscillators. ITC 2015: 1-10 - [c9]Sergej Deutsch, Krishnendu Chakrabarty:
Test and debug solutions for 3D-stacked integrated circuits. ITC 2015: 1-10 - 2014
- [j2]Krishnendu Chakrabarty, Mukesh Agrawal, Sergej Deutsch, Brandon Noia, Ran Wang, Fangming Ye:
Test and Design-for-Testability Solutions for 3D Integrated Circuits. IPSJ Trans. Syst. LSI Des. Methodol. 7: 56-73 (2014) - [j1]Sergej Deutsch, Krishnendu Chakrabarty:
Contactless Pre-Bond TSV Test and Diagnosis Using Ring Oscillators and Multiple Voltage Levels. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 33(5): 774-785 (2014) - [c8]Sergej Deutsch, Krishnendu Chakrabarty:
Massive signal tracing using on-chip DRAM for in-system silicon debug. ITC 2014: 1-10 - [c7]Erik Jan Marinissen, Bart De Wachter, Stephen O'Loughlin, Sergej Deutsch, Christos Papameletis, Tobias Burgherr:
Vesuvius-3D: A 3D-DfT demonstrator. ITC 2014: 1-10 - 2013
- [c6]Sergej Deutsch, Krishnendu Chakrabarty:
Non-invasive pre-bond TSV test using ring oscillators and multiple voltage levels. DATE 2013: 1065-1070 - [c5]Sergej Deutsch, Krishnendu Chakrabarty:
Robust optimization of test-architecture designs for core-based SoCs. ETS 2013: 1-6 - [c4]Sergej Deutsch, Krishnendu Chakrabarty, Erik Jan Marinissen:
Uncertainty-aware robust optimization of test-access architectures for 3D stacked ICs. ITC 2013: 1-10 - 2012
- [c3]Sergej Deutsch, Krishnendu Chakrabarty, Shreepad Panth, Sung Kyu Lim:
TSV Stress-Aware ATPG for 3D Stacked ICs. Asian Test Symposium 2012: 31-36 - [c2]Sergej Deutsch, Brion L. Keller, Vivek Chickermane, Subhasish Mukherjee, Navdeep Sood, Sandeep Kumar Goel, Ji-Jan Chen, Ashok Mehta, Frank Lee, Erik Jan Marinissen:
DfT architecture and ATPG for Interconnect tests of JEDEC Wide-I/O memory-on-logic die stacks. ITC 2012: 1-10 - 2011
- [c1]Sergej Deutsch, Vivek Chickermane, Brion L. Keller, Subhasish Mukherjee, Mario Konijnenburg, Erik Jan Marinissen, Sandeep Kumar Goel:
Automation of 3D-DfT Insertion. Asian Test Symposium 2011: 395-400
Coauthor Index
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